News
News
CHINAPLAS 2026 Opens in Shanghai Time:2026-04-25


April 21, 2026 - CHINAPLAS 2026  officially opened at the National Exhibition and Convention Center (NECC), Hongqiao, Shanghai, PR China. The exhibition has once again set a new record, expanding to over 390,000 sqm, spanning 16 exhibition halls and fully occupying the entire venue. More than 5,000 quality exhibitors from around the world have gathered, representing an increase of 11% compared with the 2024 edition in Shanghai, demonstrating the industry’s robust resilience and strong momentum.




Prices of plastic raw materials are experiencing rapid variations, making the stability and resilience of industrial and supply chains a pressing global issue. As the world’s leading plastics and rubber exhibition, this four‑day event (April 21–24) is themed “Transformation · Collaboration · Sustainability”, focusing on four core directions: Circular Economy, Digitalization, Innovative Materials, and China’s High-end Technologies. The exhibition presents global innovations in smart, green, and innovative technologies, strengthening confidence in today’s uncertain global market and guiding the high‑quality development of the plastics and rubber industries.




Materials drive product upgrades. With a record high of over 1,900 materials exhibitors, CHINAPLAS 2026 reflects surging demand for innovative materials.

On the fairground, visitors were greeted by a panorama of innovative materials designed to meet the evolving demands of both traditional manufacturing and emerging industries, such as new energy, energy storage, low‑altitude economy, humanoid robots, advanced medical devices, etc. Innovative engineering plastics and polyurethane applied to EV battery packs help reduce overall vehicle weight, optimize thermal management, and enhance safety performance. High‑performance polymers, such as PEEK, PI, PPS, and PPSU valued for their high heat‑deflection temperatures, dielectric properties, and self‑extinguishing flame resistance, are finding wide application in aerospace and electronics and electric fields. Carbon‑fiber reinforced composites, combining high strength, rigidity, and lightweight advantages, enable drones and humanoid robots to achieve lightweighting while boosting performance. PCTFE, which is resistant to brittleness and creep in highly corrosive environments, is suitable for semiconductor equipment, chemical instruments, and medical analyzers. Impact‑resistant and thermally conductive polycarbonate is designed for data centers and supercomputing servers. Innovative BOPE, with high stiffness and transparency, enables easier recycling and reuse when applied to packaging materials. High‑performance medical‑grade plastics, featuring excellent biocompatibility and resistance to ethylene oxide sterilization, are suitable for precision devices, such as ultrasonic scalpels and staplers. Traditional printing machine, packaging machine, coating machine and digital printing press are also showing off their cool stuff !